SMD placement includes the latest component spectrum from 0201 to QFP, BGA, µBGA, CBGA, CSP and flip-chip.

Data import from CAD data is possible with MYDATA CAD-Conversion software resulting in quicker programming.

Depending on the quantity of components, SMD placement is carried out either in-line automatically with a Hydra placement head or on stand-alone-machines. Once placement is completed the best possible soldering result is achieved with an ERSA Hotflow in a nitrogen atmosphere.

We can carry out AOI inspections up to dimensions of 400mm x 450mm. Our Metcal VPI-1000 is capable of carrying out optical inspections on BGA, µBGA, CBGA, CSP and flip-chips.

Some examples of our equipment

• SP900 In-line printer with 2-D inspection
• MyData My12 Hydra with ERSA Hotflow 2/12 N² in-line
• EKRA printer
• MyData TP9
• Mirtec AOI system
• BGA control system Metcal VPI-1000